1 / 4 www .asb.co.kr august 20 1 7 p lerow tm aln2504at internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment o f the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessa ry just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 2300 2700 gain db 13 14 gain flatness db ? 0.6 ? 0.8 noise figure db 0.8 0.85 output ip3 (1) dbm 31 32 s11 / s22 (2) db - 12 / - 10 output p1db dbm 17 1 8 switching time (3) ? sec 1 supply current ma 60 80 supply voltage v 5 impedance ? 50 package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line d rawing (unit: mm) feature s s 21 = 14.6 db @ 2300 mhz = 13.4 db @ 2700 mhz nf of 0.8 db over fr e quency unconditionally stable single 5v supply high oip3 @ low cu rrent note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf groundin g consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion description (recommended footprint) aln2504at asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) 1 - stage single type typ. @ t = 25 ? c, v s = 5 v, freq. = 2500 mhz, z o.sys = 50 ohm specifications (in pr o duction)
2 / 4 www .asb.co.kr august 20 1 7 p lerow tm aln2504at internally matched lna module s - param e ters noise figure oip3 p1db 2300~2700 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www .asb.co.kr august 20 1 7 p lerow tm aln2504at internally matched lna module item voltage s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current ( ma) 4.5 - 13.19 - 12.21 14.01 0.99 0.778 16.95 32.70 53 4.6 - 13.24 - 12.19 14.05 0.98 0.779 17.14 32.94 55 4.7 - 13.33 - 12.14 14.09 0.98 0.787 17.36 33.19 57 4.8 - 13.39 - 12.09 14.12 0.97 0.795 17.55 33.24 60 4.9 - 13.41 - 11.95 14.14 0.97 0.798 17.74 32.88 62 5.0 - 13.48 - 11.94 14.15 0.96 0.800 17.92 32.69 64 5.1 - 13.50 - 11.84 14.17 0.96 0.802 18.05 32.50 66 5.2 - 13.55 - 11.78 14.20 0.95 0.814 18.26 32.05 68 5.3 - 13.59 - 11.69 14.22 0.95 0.825 18.41 31.78 70 5.4 - 13.62 - 11.60 14.23 0.95 0.834 18.56 31.59 7 2 5.5 - 13.64 - 11.52 14.24 0.95 0.840 18.71 31.26 73 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 13.61 - 10.17 15.25 0.90 0.489 17.99 29.43 61 - 20 ? c - 13.67 - 10.63 15.08 0.93 0.617 17.99 31.44 6 3 0 ? c - 13.74 - 10.73 14.94 0.93 0.706 17.94 32.47 63 25 ? c - 13.72 - 10.63 14.80 0.94 0.807 17.88 32.79 64 40 ? c - 13.68 - 10.51 14.72 0.94 0.889 17.73 32.17 64 60 ? c - 13.67 - 10.38 14.52 0.94 1.014 17.42 30.78 64 80 ? c - 13.68 - 10.16 14.41 0.95 1.107 17.12 30.4 2 62 100 ? c - 13.67 - 9.95 14.25 0.95 1.249 16.65 29.04 61 rf performance with voltage change rf performance with operating temperature
4 / 4 www .asb.co.kr august 20 1 7 p lerow tm aln2504at internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefo re, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. copyright ? 2008 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assumes no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. application circuit recommended solderi ng reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm)
|
